Coreless

ACCESS holds a proprietary, patented technology for fabricating coreless substrates. ACCESS can minimize thickness by constructing the substrate without a central core, providing what is known as a "core-less substrate". The total substrate thickness is thereby significantly reduced, improving both its thermal impedance and its electrical performance.

Furthermore, eliminating the core section provides the designer with identical Design Rules for all substrate sections - with no difference between the core and the SBU layers, and helps save layer counts and/or add more “significant” layers in the constant striving to reduce substrate form factor and/or higher density per layer.